DIP封装器件密封失效机理研究  

Study on Sealing Failure Mechanism of DIP Packaging Device

作　　者：袁永举 YUAN Yongju(The Second Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2018年第4期209-211,共3页Electronics Process Technology

摘　　要：针对某型号DIP封装器件结构在温度循环试验中出现的密封失效现象,运用FMECA进行失效分析。分析结果表明,密封失效最根本的原因是各部件线膨胀系数不同产生了不协调变形,导致结构局部的高应力和高应变,使得瓷体脆性断裂,或使得焊框与陶瓷底座开裂,导致密封失效。FMECA is used to analyze the sealing failure of DIP packaging in temperature cycle test. The analysis results show that the most fundamental reason of sealing failure is that the linear expansion coefficient of each component is different, which leads to uncoordinated deformation, and the high stress and high strain of the structure. Which makes the ceramics brittle fracture, or the crack between the soldering frame and the ceramic base, and the sealing failure is occurred.

关 键 词：失效分析 温度 应力 DIP封装 热失配 

分 类 号：TN305[电子电信—物理电子学]