无源RFID感温标签设计过程中导电性和导热性分析  

Analysis of Electrical and Heat Conductivity in the Design Process for Passive RFID Temperature Sensitive Label

作　　者：杨跃胜[1] 武岳山[1,2] YANG Yue-sheng;WU Yue-shan(Invengo Information Technology Co.,Ltd,Shenzhen 518057,China;School of Information Science ＆ Technology,Northwest University,Xi＇ an 710127,China)

机构地区：[1]深圳市远望谷信息技术股份有限公司,广东深圳518057 [2]西北大学信息科学与技术学院,陕西西安710127

出　　处：《中国集成电路》2018年第8期43-47,共5页China lntegrated Circuit

摘　　要：分析了芯片封装环节上芯工艺中固晶材料的导电系数和导热系数的概念及表示方法,阐述了金属材料导电和导热的原理,并给出了两者之间的数学关系。结合实际感温芯片封装时所用胶体的型号及导电导热参数,给出RFID感温芯片封装环节所用到的参考胶体及使用规则。最后分析了感温标签天线载体PCB介质及芯片封装具体规格的热传导性能对RFID感温标签设计的重要性。文章对无源RFI D感温芯片封装及标签设计具有一定参考意义。The concept and expression method of specific conductivity and heat conductivity in chip packaging are analyzed. The principle of electrical and heat conduction of metallic is expounded,and the mathematical relationship between them is given. According to the colloids and the electrical and heat conduction parameters used in the packaging of temperature sensitive chips,the reference colloids and rules used of RFID temperature sensing chip are given. Finally,the heat conductivity importance of PCB and package specifications for the RFID sensing temperature label design is analyzed. The paper has reference significance in the packaging and label design for the passive RFID temperature sensing chip.

关 键 词：导热系数 导电系数 感温标签 RFID 芯片封装 

分 类 号：TN85[电子电信—信息与通信工程]