基于ARM的自动打包温度控制系统  

Automatic Packaging Temperature Control System Based on ARM

作　　者：林旭梅[1] 马士强 刘振东 刘云飞 王雨露 LINXumei;MAShiqiang;LIUZhendong;LIUYunfei;WANGYulu(Qingdao University of Technology,Qingdao 266520,China)

机构地区：[1]青岛理工大学,山东青岛266000

出　　处：《电工技术》2018年第16期26-27,29,共3页Electric Engineering

摘　　要：针对自动封装结构对温度控制要求较高的问题,提出了一种基于ARM Cortex-M3为MCU的控制方案。阐述自动封装工作原理,介绍硬件、软件系统设计。In order to solve the problem of high temperature control requirements of the automatic packer,a scheme based on STM32 MCU control was proposed.The working principle,hardware and software system designof automatic packaging were introduced.

关 键 词：温度控制 桥式电路 PID算法 脉宽调制技术 

分 类 号：TB486.3[一般工业技术—包装工程]