微量Pr添加对Sn-9Zn钎料/Cu界面特征的影响  

Effect of Pr Addition on Interface Characteristics of Sn-9Zn Solder/Cu

作　　者：景彦霞 JING Yanxia(College of Education,Chongqing University of Arts and Science,Chongqing 402160)

机构地区：[1]重庆文理学院教育学院,重庆402160

出　　处：《济源职业技术学院学报》2018年第3期64-67,共4页Journal of Jiyuan Vocational and Technical College

摘　　要：研究了0.1wt.%稀土元素Pr在Sn-9Zn中的添加对合金显微结构的影响,分析了Sn-9Zn-XPr(X=0,0.1)合金钎料/Cu焊点界面化合物微观结构特征。结果表明,微量稀土元素Pr添加能够显著细化Sn-9Zn钎料组织,合金中局部Pr富集形成的Pr Sn3化合物相呈"花朵状";0.1wt.%Pr元素添加能够Sn-9Zn合金钎料/Cu界面反应更为充分和均衡,界面IMC尺寸细化且分布均匀。The effect of the 0.1wt% rare earth element Pr added in Sn-9Zn on the microstructure of the alloy is studied.The microstructure characteristics of Sn-9Zn-XPr（X=0,0.1） alloy solder/Cu solder joint interface compound are also analyzed.The results show that the addition of Sn to the Sn-9Zn can significantly refine the Sn-9Zn solder structure.The PrSn 3 compound phase formed by local Pr enrichment in the alloy is “flower-like”; The interfacial reaction of Sn-9Zn/Cu becomes more sufficient and balanced with 0.1wt% Pr addition,and the IMC size is refined and evenly distributed.

关 键 词：PR SN-9ZN钎料 界面化合物 微观结构 

分 类 号：TG454[金属学及工艺—焊接]