BTC器件底部助焊剂残留物形成机理与影响研究  

Study on Formation Mechanism and Influence of Flux Residue at Bottom of BTC Device

作　　者：梁剑[1] 郑正德 王玉[1] LIANG Jian;ZHENG Zhengde;WANG Yu(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2018年第5期307-310,共4页Electronics Process Technology

摘　　要：在组装底部焊端类器件时,由于PCB和器件之间的离板高度很小,大部分小于0.2 mm,在再流焊过程中锡膏中的挥发物逃逸困难,容易引发引脚间阻抗降低的问题,导致芯片烧毁或功能丧失。着重对产生这些问题的机理进行研究分析,并探讨了两种解决方案。When assembling bottom terminal component devices, the volatile matter in solder paste is difficult to escape during reflow soldering because the height between PCB and devices is very small, most of them are less than 0.2 mm, which is easy to cause the problem of impedance reduction between leads, lead to chip burnout or loss of function. The mechanism of these problems is studied and analyzed, and two solutions are discussed.

关 键 词：电子组装 SMT BTC 助焊剂残留 阻抗降低 

分 类 号：TN605[电子电信—电路与系统]