杜瓦及热电致冷封装中的温度传感器  

Temperature Sensors in Dewar and TE Cooling Packages

作　　者：张忆南 朱宪亮[1] 洪斯敏[1] 李雪[1] ZHANG Yi-nan;ZHU Xian-liang;HONG Si-min;LI Xue(Key Laboratory of Infrared Imaging Materials and Devices,Shanghai Institute of Technical Physics Chinese Academy of Sciences,Shanghai 200083,China)

机构地区：[1]中国科学院上海技术物理研究所红外成像材料与器件重点实验室,上海200083

出　　处：《红外》2018年第10期1-11,共11页Infrared

摘　　要：在对红外光电探测器及焦平面封装结构中常用的三大类若干种温度传感器的特点及关键参数等进行整理的基础上,分析了不同种类传感器的测控精度及误差特点,并对不同温区封装结构中选用温度传感器需要考虑的因素以及使用时需要注意的问题进行了详细讨论。The characteristics and key parameters of various temperature sensors in three categories commonly used in the packaging structures of infrared photodetectors and focal plane arrays are summarized. On this ba sis, the measurement and control accuracy and error of different types of sensors are analyzed. Finally, the factors which need to be considered in the selection of temperature sensors for the packages in different tern perature zones and the matters which need attention in practical application are discussed in detail.

关 键 词：电阻温度探测器 半导体温度传感器 热电偶 杜瓦封装 热电致冷 封装 

分 类 号：TB942[一般工业技术—计量学]