焊锡粉对焊锡膏粘度稳定性的影响  

The Effect of Solder Powder on Viscosity Stability of Solder Paste

作　　者：武信 秦俊虎 白海龙 刘宝权 WU Xing;QIN Jun-hu;BAI Hai-long;LIU Bao-quan(Yunnan Tin Industry Tin Material Co.,Ltd.,Kunmin,Yunnan 650501,China)

机构地区：[1]云南锡业锡材有限公司,云南昆明650501

出　　处：《云南冶金》2018年第5期59-63,共5页Yunnan Metallurgy

摘　　要：研究了焊锡粉表面光洁度及氧含量高低对焊锡膏粘度稳定性的影响,试验采用扫描电镜(SEM)分析焊锡粉表面光洁度,采用RO500氧分析仪测试焊锡粉的氧含量,采用日产粘度测试仪PCU-205测试焊锡膏粘度值。实验结果表明:焊锡粉表面越光滑,所制备焊锡膏的粘度稳定性越好,且焊锡粉的氧含量在80～120 mg/kg时制备的焊锡膏粘度稳定性较好。The effect of surface finishes and oxygen content of solder powder on viscosity stability of solder paste is studied,thesurface finishes of solder powder is analyzed by scanning electron microscope （ SEM） ,the oxygen content of solder powder is measured byRO500 oxygen analyzer,and the viscosity number of solder paste is measured by viscosity tester PCU - 205 produced by Japan. The test results show：the more slide of the solder powder surface,the better viscosity stability of the solder paste,and the solder paste has the betterviscosity stability when the oxygen content of solder powder is 80 - 120ppm.

关 键 词：焊锡膏 表面光洁度 稳定性 氧含量 

分 类 号：TU512.3[建筑科学—建筑技术科学]