芯片层叠塑料封装的MEMS惯性器件的开封方法  

Decapsulation Method for Stacked-die Chip Packaged MEMS Inertial Devices

作　　者：林晓玲 梁朝辉[2] 何春华 LIN Xiaoling;LIANG Chaohui;HE Chunhua(Science and Technology on Reliability Physics and Application of Electronic ComponentLaboratory,Guangzhou 510610,China;CEPREI,Guangzhou 510610,China)

机构地区：[1]电子元器件可靠性物理及其应用技术重点实验室,广东广州510610 [2]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2018年第4期49-53,共5页Electronic Product Reliability and Environmental Testing

摘　　要：芯片叠层封装是MEMS惯性器件的一种重要封装形式,此类封装的结构特殊性给传统的开封方法带来了极大的困难。提供了一种针对芯片层叠塑料封装MEMS惯性器件的开封技术及其流程,并给出了实际的应用案例。该开封技术综合激光刻蚀法、化学腐蚀法等开封方法,实现了芯片层叠塑料封装MEMS惯性器件中内部结构的逐层开封及暴露,为此类型封装器件的内部目检提供了技术支撑。Stacked-die chip package is an important packaging form of MEMS inertial devices,but the structural specificity of such packaging brings great difficulties to the traditional unpacking method. An unpacking technology and its process aiming at MEMS inertial devices packaged through stacked-die chip package technology is proposed, and a practical application case is given. The proposed unpacking technology integrates the laser etching method and the chemical etching method, and it realizes the unpacking and exposure of the internal structure of MEMS inertial devices packaged through stacked-die chip package layer by layer, which provides technical support for the internal visual inspection of this type of packaging device.

关 键 词：芯片叠层封装 微电子系统惯性器件 开封 塑料 

分 类 号：V241.5[航空宇航科学与技术—飞行器设计] V241.6