基于对角线的硅通孔容错设计  

Diagonal-Based for TSV Fault Tolerance Design

作　　者：刘军[1,2] 董鹏[1,2] 任福继 LIU Jun;Dong Peng;REN Fu-ji(School of Computer and Information,Hefei University of Technology,Hefei 230009,China;Anhui Province Key Laboratory of Affective Computing and Advanced Intelligent Machine,Hefei University of Technology,Hefei 230009,China;Department of Information Science ~ Intelligent Systems,Faculty of Engineering,The University of Tokushima,Tokushima 7708502,Japan)

机构地区：[1]合肥工业大学计算机与信息学院,安徽合肥230009 [2]合肥工业大学情感计算与先进智能机器安徽省重点实验室,安徽合肥230009 [3]日本德岛大学先端技术科学教育部,日本德岛7708502

出　　处：《微电子学与计算机》2018年第11期73-78,共6页Microelectronics & Computer

基　　金：国家自然科学基金(61432004;61306049;61474035)

摘　　要：三维集成电路通过使用硅通孔(through-silicon vias,TSV)作为垂直方向上芯片的通信链路,具有高密度,高带宽,低功耗等优点.由于TSV在制造和使用过程中可能会出现故障,导致整个三维芯片的故障.为了提高三维芯片的良品率,TSV的良品率必须尽可能的提高.本文提出了一种新的基于对角线的TSV容错方案,并提出了基于最大流算法的故障修复算法,在TSV出现故障时使用对角线中的冗余TSV来修复故障TSV以提高整个三维芯片的良品率.实验结果表明,相比基于路由的容错方案,本文提出的基于对角线的TSV容错方案,芯片修复率可以达到98.38%至98.96%,方案造成的面积开销降低了70%左右。Three dimensional integrated circuits,using through-silicon vias（TSVs）as the communication link between vertical chip,with the advantages of high density,high bandwidth and low power consumption.As the TSV during processing and using process may be failure,will lead to the entire three-dimensional chip failure.In order to improve the yield of 3 Dchips,the yield of TSV must be raised as much as possible.This paper presents a novel diagonal-based redundant TSV repair scheme and proposes a repair algorithm based on maximum flow algorithm to tolerance the faulty TSV with redundant TSVs in the diagonal to improve the yield of the entire threedimensional chip.Experimental results show that the yield of the proposed repair strategy is 98.38% to 98.96%and the hardware overhead can be reduced by up to 70%compared to router-based technique.

关 键 词：硅通孔 对角线 故障修复 

分 类 号：TP391[自动化与计算机技术—计算机应用技术]