适合HDIPCB直接弯曲成型的半挠性无卤覆铜板的研发与应用  

Development of halogen free semi-flexiblecopper clad laminate for HDI PCB directly bending modeling

作　　者：刘东亮[1] 陈飞 吕吉[1] 尹建洪[1] 杨中强[1] Liu Dongliang;Chen Fei;Lv Ji;Yin Jianhong;Yang Zhongqiang

机构地区：[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《印制电路信息》2018年第A02期39-44,共6页Printed Circuit Information

摘　　要：文章通过对橡胶、酚氧等增韧剂和环氧等树脂的共混改性研究，发现使用一定比例用量的上述橡胶和酚氧等增韧剂时，所得树脂组合物的韧性明显改善，制作覆铜板的可弯曲性能明显提升，如180°弯曲性能可以达到50次以上，此外。也可以将上述半挠性覆铜板制作成半挠性PCB后直接冲压成型一定台阶或角度，为静态弯曲安装PCB提供一种新材料和新工艺，可以实现传统的刚挠结合PCB的“3D”连接功能。In this paper, it developed the epoxy resin blend modified by toughening agent such as rubber, phenoxy resin, etc. and found that toughness of the resin composition could be obviously improved. For example, the prepared CCL or PCB bending performance of 180 degree could reach more than 50 times. In addition, the PCB could be directly stamped to form a certain step. So it could design a kind of halogen free semi-flexible copper clad laminate for3D interconnection application replacing traditional rigid-flex PCB.

关 键 词：增韧改性环氧树脂 半挠性覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]