凹蚀段对板面咬蚀的机理研究  

Mechanism of desmear process etching on surface copper in PCB production

作　　者：林秀鑫 纪锦城 许侄彪 Lin Xiuxin;Ji Jincheng;Xu Zhibiao

机构地区：[1]汕头超声印制板公司,广东汕头515065

出　　处：《印制电路信息》2018年第A02期318-322,共5页Printed Circuit Information

摘　　要：在凹蚀工艺流程设计上，有将还原药水抽至凹蚀后水洗缸进行预中和的做法。但是在日常跟进中，发现该做法存在咬蚀板面的隐患，因此对其影响机理进行分析，并试验确定具体控制要求。避免出现类似板面不良。In general desmear process, chemistry suppliers recommend to pump a little of reduction solution to the rinse tank after permanganate treatment to extend reduction solution bath life. However, there are some risks on cosmetic of copper surface in this operation. To avoid this issue, this paper tries to study the mechanism and make operation range for better process control.

关 键 词：沉铜 凹蚀 还原剂 板面咬蚀 

分 类 号：TN41[电子电信—微电子学与固体电子学]