电沉积制备铜/镍-钨-磷新阴极材料的研究  

Studies on the electrodeposition preparation of a new cathodic material copper/nickel-tungsten-phosphorus

作　　者：李思平[1] 谢原寿[1] 柳全丰 

机构地区：[1]湘潭大学化学院,湖南湘潭411105 [2]湘潭电化集团,湖南湘潭411105

出　　处：《电镀与涂饰》2002年第4期9-13,共5页Electroplating & Finishing

摘　　要：用电沉积法制备铜 /镍 -钨 -磷阴极材料。研究了镀液成分及工艺条件对镀层成分的影响。测量了铜 /镍 -钨 -磷镀层的电催化析氢性能以及在硫酸 /硫酸锰溶液中的稳定性。模拟二氧化锰电解生产的条件 ,测定了该阴极材料的槽电压 ,并与石墨和铜进行了比较。结果表明 ,铜 /镍 -钨A new cathodic material copper/nickel-tungsten-phosphorus was prepared by electrodeposition. The effect of bath compositions and operating conditions on content of the alloy deposit was studied. Properties of the obtained composite deposit such as electrocatalytic hydrogen evolution and stability in sulfuric acid/ manganese sulfate solution were tested. Bath voltages were measured and compared with copper/nickel-tungsten-phosphorus composite deposit, graphite and copper cathodes in simulated production of manganese dioxide by electrolysis. Results show that copper/nickel-tungsten-phosphorus is an excellent cathodic material for the production of manganese dioxide by electrolysis.

关 键 词：电沉积 制备 铜/镍-钨-磷 阴极材料 研究 二氧化锰 电解 

分 类 号：TQ153.2[化学工程—电化学工业]