RF磁控溅射工艺对TiNi_(1-x)Cu_x合金薄膜组织形貌的影响  

Influence of RF magnetron sputtering processes on morphology of TiNi_(1-x)Cu_x alloy films

作　　者：李亚东[1] 崔大奎 骆苏华[3] 

机构地区：[1]苏州大学材料工程学院,江苏苏州215006 [2]韩国全北国立大学工学院,全北道全州561756 [3]苏州大学物理系,江苏苏州215006

出　　处：《材料科学与工艺》2002年第3期295-298,共4页Materials Science and Technology

摘　　要：采用RF磁控溅射技术制备了TiNi(1-x)Cux合金薄膜,利用扫描电镜、电子能谱仪和XRD技术分析研究了RF磁控溅射工艺对TiNi(1-x)Cux合金薄膜组织形貌的影响规律.结果表明:在基片不加热的条件下溅射薄膜组织结构为非晶,并呈柱状形貌垂直于基片生长;经650～720℃,3 min退火处理后,薄膜均发生晶化转变;在他它条件相同的情况下,溅射功率和工作气压对薄膜组织形貌有很大影响;薄膜的柱状单胞直径、薄膜厚度和生长速度均随溅射功率的增长而增长,但当溅射功率一定时,工作气压增加使柱状单胞直径、薄膜厚度和薄膜的生长速率显著减小;RF磁控溅射过程中,沉积原子的活性及其沉积速率是影响薄膜组织形貌的主要原因.In this paper the influence of RF magnetron sputtering processes on the morphology of TiNi(1-x)Cux alloy films was studied by using X - ray diffraction (XRD) and scanning electron microscopy ( SEM) . The experimental results show that the microstructure of the magnetron sputtering alloy films has a columnar grain texture, the as-sputtered films deposition onto a non-artificial heated substrate using the targets of Ti -50.64at. %Ni and Ti -46.80at. %Ni -3.65at. %Cu alloy, are amorphous. The grain size, thickness and deposition rate of the thin films increased linearly with sputtering power and decreased with sputtering pressure. The activity and deposition rate of sputtered atoms were main reasons for influencing film morphologies.

关 键 词：RF磁控溅射工艺 TiNi(1-x)Cux合金薄膜 组织形貌 钛镍铜合金 

分 类 号：TB34[一般工业技术—材料科学与工程] O484[理学—固体物理]