厚膜金导体浆料用类球形金粉制备研究  

Preparation of spherical gold powder for thick film gold conductor paste

作　　者：郑权[1] 刘卓峰[1] 张为军[1] ZHENG Quan;LIU Zhuofeng;ZHANG Weijun(College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China)

机构地区：[1]国防科技大学航天科学与工程学院,湖南长沙410073

出　　处：《电子元件与材料》2017年第8期55-59,共5页Electronic Components And Materials

基　　金：国家"863"项目资助(No.2012BAE06B06)

摘　　要：分别以抗坏血酸(VC)、草酸、对苯二酚、亚硫酸钠和硫酸亚铁为还原剂,以阿拉伯树胶为分散剂还原雷酸金制备金粉。利用SEM对所制金粉进行了表征,分析了还原剂种类对金粉形貌和粒径的影响。并且以弱还原性的VC作为还原剂,分别探究了分散剂种类、用量及反应体系p H值、加入速度和温度对金粉粒径的影响。经过优化工艺,在金溶液浓度为20 g/L,p H值为4,质量比ζ(阿拉伯树胶:Au)=5:2,反应温度为50℃,金溶液加入速度为110 m L/min时,制备出呈类球形形貌和约2μm粒径的金粉。The gold powders were obtained by chemical reduction of fulminating gold with vitamin C(VC),oxalic acid,hydroquinone,sodium sulfite or ferrous sulfate as reducing agent,and acacia gum and PVP as dispersing agent.The prepared gold powders were characterized by SEM and the effect of type of reducing agent on morphology of gold particles was discussed.The weak reductive VC was chosen as the reducing agent for preparing spherical gold powders.The influences of the dispersant type and its consumption,the pH value,adding speed and temperature of the reaction system on gold particle size were investigated.The results show that the gold powders with spherical morphology and particle size of about2μm are prepared while the mass concentration of gold solution is20g/L,the pH value is4,the mass ratio of acacia gum to Au is5:2,the reaction temperature is50℃and the gold solution addition rate is110mL/min.

关 键 词：金粉 类球形 粒径 抗坏血酸 阿拉伯树胶 金导体浆料 

分 类 号：TN623[电子电信—电路与系统]