SiC/Al复合材料的热导率研究  

Research on the Thermal Conductivity of SiC/Al Composite

作　　者：王涛[1] WANG Tao(College of Materials Science and Engineering, Xian University of Science and Technology, Xian 710054, China)

机构地区：[1]西安科技大学材料科学与工程学院,西安710054

出　　处：《人工晶体学报》2017年第10期2062-2066,共5页Journal of Synthetic Crystals

摘　　要：用无压浸渗法制备了高导热的SiC/Al电子封装材料。采用光学显微镜、X射线衍射仪、扫描电镜和激光热导仪对复合材料导热率、晶体结构和微观形貌进行了分析,研究了SiC颗粒大小、形状、体积分数、基体中Mg的含量和预氧化等参数对SiC/Al复合材料的导热率的影响。结果表明,选择适当的原料参数和工艺参数可制得导热率高达172.27 W/(m·k)的SiC/Al复合材料,满足电子封装材料的要求。High thermal conductivity SiC/A1composites were prepared by presureless infiltration method,the crystal phases,micrographs and thermal conductivity were analysed by XRD,SEM and laser thermalconductance instrument.The effect of SiC particle size,shape,volume fraction,Mg content and the pre-oxidation on thermal conductivity of samples were studied.The results show:the thermal conductivity of samples can be as high as172.27W/(m.k)and meet the eletronic packing materials requirements with suitable raw materials and process parameters.

关 键 词：SIC/AL复合材料 无压浸渗 导热率 电子封装 

分 类 号：TQ163[化学工程—高温制品工业]