光窗封接工艺对光电外壳抗强冲击影响的研究  

Research on Improving the Anti Shock Ability of Photoelectric Shell with Light Window

作　　者：杨拓 江德凤 王彬彬 YANG Tuo;JIANG Defeng;WANG Binbin(Chongqing Acoustic-Optic-Electronic Co.Ltd.,Chongqing 400060, China)

机构地区：[1]重庆声光电有限公司外壳事业部,重庆400060

出　　处：《电子与封装》2017年第11期1-5,共5页Electronics & Packaging

摘　　要：通过对三种光窗封接工艺的对比分析,探索了怎样提高带光窗光电外壳的抗强冲击能力。运用有限元软件ANSYS分析MBCY009-W8W的局部封接工艺、高温封接工艺、低温钎焊工艺及其存在微裂纹对抗强冲击能力的影响。按GJB548B-2005方法 2002.1对样品进行机械冲击试验,结果表明低温钎焊工艺很好地满足抗强冲击的要求,研究在有强冲击载荷要求的光窗封接上有潜在的应用价值。The paper explores how to improve the anti strong shock capability of the photoelectric shell with light window through the comparison of the three sealing technology.The finite element software ANSYS is used to analyze the influence of local sealing technology,high temperature sealing technology and low temperature brazing technology ofMBCY009-W8Wand micro crack against strong shock.Combining the way2002.1of GJB548B-2005,the mechanical impact experiments on samples are conducted.The experiment results showthe lowtemperature brazing process can well meet the requirements of strong shock.The research has proved of great use and value in the optical windowsealwith strong impact loading requirement.

关 键 词：局部封接工艺 高温封接工艺 低温钎焊工艺 抗强冲击能力 

分 类 号：TN305.94[电子电信—物理电子学]