全尺寸手机跌落的LS-DYNA数值模拟  

Numerical Simulation of Mobile Phone Drop Based on LS-DYNA

作　　者：李旦[1] 赵廷渝[1] 王永虎[1] LI Dan;ZHAO Tingyu;WANG Yonghu(School of Flight Technology, Civil Aviation Flight University of China, Guanghan, Sichuan 618307, China)

机构地区：[1]中国民用航空飞行学院飞行技术学院,四川广汉618307

出　　处：《宜宾学院学报》2017年第12期28-31,共4页Journal of Yibin University

基　　金：国家自然科学基金民航联合研究基金项目(U1333133);四川省教育厅科研项目(16ZB030)

摘　　要：采用基于ANSYS/LS-DYNA的产品跌落仿真方法,对华为荣耀8全尺寸手机跌落过程进行数值模拟,通过选取手机冲击区内三个网格单元和三个节点,得到手机网格与节点处有效应力、材料变形、速度与加速度响应等动态特性,结果表明:在2 ms的垂直跌落过程中,最大应力在0.9 ms时取得,达到2.2×10~7Pa,且位于冲击区圆角处.由此可推断手机的易损位置,以对质量问题进行改进,进一步缩短电子产品开发周期,节约成本,为产品造型和工艺参数优化提供一定的技术参考.Based on ANSYS/LS-DYNA drop simulation method,the numerical simulation of the process of mobile phone dropping of Huawei Honor8was carried out.By selecting three grid cells and three nodes in the mobile phone impact area,the effectivestress,material deformation,speed and acceleration response were acquired.The results show that the maximum stress is obtained at0.9ms in the vertical drop process of2ms,reaching2.2×107Pa and at the corner of the impact zone.Thus,the vulnerable locationof the phone would be found for improving the quality,shortening the development cycle of electronic products and saving the cost,which will provide a certain technical reference on optimizing the product modeling and process parameters.

关 键 词：结构强度 数值模拟 动态特性 产品造型 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]