结晶硅微粉对KBJ元器件封装用EMC气孔的影响  

The Effect of Crystalline Silicon Powder on the Void of EMC Encapsulation in KBJ Device Package

作　　者：张未浩 谢广超 于轩 丁全青 陈波 ZHANG Weihao;XIE Guangchao;YU Xuan;DING Quanqing;CHEN Bo(Hysol Huawei Electronics Co.,Ltd.,Lianyungang 222006,China)

机构地区：[1]衡所华威电子有限公司,江苏连云港222006

出　　处：《电子与封装》2018年第1期5-7,25,共4页Electronics & Packaging

摘　　要：以3种不同类型的结晶硅微粉为主要填料,环氧树脂为基体树脂,酚醛树脂为固化剂,通过调节3种结晶硅微粉的含量和比例,制备出3种不同的环氧模塑料(EMC)并用于封装KBJ元器件。采用激光粒度分析仪分析3种结晶硅微粉的粒径,毛细流变仪测试EMC粘度,万能测试机、恒温加热板测试其螺旋流动长度和凝胶化时间,并研究3种不同EMC对封装KBJ元器件中气孔的影响。Based on three different types of crystalline silica powder filler,epoxy resin as matrix resin,phenolic resin as curing agent,by adjusting the content and ratio of three crystalline silica powders,three different epoxy molding plastics(EMC)were prepared and used to encapsulate KBJ components.The particle size analysis of three crystalline silica fume was carried out by using laser particle size analyzer,and the capillary rheometer was used to test the flowlength and gelation time of EMCviscosityand universal tester and thermostatic heating plate,and studythe influence of three different EMCon the void of encapsulated KBJ components.

关 键 词：结晶硅微粉 环氧模塑料 气孔 KBJ元器件 

分 类 号：TN305.94[电子电信—物理电子学]