Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头电迁移组织与性能  

Electromigration Microstructure and Properties of Sn2.5Ag0.7Cu0.1RE/Cu Solder Joints

作　　者：孙萌萌[1,2] 张柯柯[1,3] 张超[1] 马宁[1] 王悔改[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471023 [2]河南科技大学有色金属共性技术河南省协同创新中心,河南洛阳471023 [3]河南科技大学河南省有色金属材料学与加工技术重点实验室,河南洛阳471023

出　　处：《河南科技大学学报（自然科学版）》2018年第3期13-16,23,共5页Journal of Henan University of Science And Technology:Natural Science

基　　金：国家自然科学基金项目(U1604132);河南省科技创新杰出人才计划基金项目(154200510022);河南省高校科技创新团队支持计划基金项目(13IRTST HN003)

摘　　要：研究了温度对Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头电迁移组织与性能的影响。随着环境温度从100℃升高到140℃,及通电时间从24 h延长到72 h,Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头阴极侧界面间金属化合物(IMC)Cu_6Sn_5逐渐变薄,由"扇贝状"变为"锯齿状"。阳极侧界面间IMC逐渐增厚,由"扇贝状"不断长大并形成凸起的小丘,且在母材接合处出现一层薄薄的Cu3Sn层。界面阳极侧IMC增加的厚度比界面阴极侧IMC减少的厚度大。Sn2.5Ag0.7Cu0.1RE/Cu钎焊接头剪切强度持续降低。随着温度升高,相应的剪切断口由钎缝区的解理与韧窝共存在的混合型断裂,逐渐变为界面阴极侧IMC的以解理为主的脆性断裂。The effect of temperature on electromigration microstructure and properties of Sn2. 5 Ag0. 7 Cu 0. 1 RE/Cu solder joints was investigated. With the ambient temperature rising from 100 ℃ to 140 ℃,and the power on time extending from 24 h to 72 h,the cathodic intermetallic compound( IMC) Cu_6Sn_5 became thinner,and the morphology was transformed from serrated to scallop. Meanwhile,the anodic IMC was gradually thickened,and the morphology was transformed from scallop to a raised hillock. Thin Cu_3Sn layer was formed on the joint of parent metal. The increased thickness of the IMC on the anode side was larger than the decreased thickness of the IMC on the cathode side. The shear strength of Sn2. 5 Ag0. 7 Cu0. 1 RE/Cu solder joints was continually decreased. With the increase of temperature,the fracture mechanism of the shear fracture transforms from mixed fracture occurred in the brazing zone to brittle fracture occurred in the cathodic IMC layer.

关 键 词：无铅钎料 钎焊接头 电迁移 组织 性能 

分 类 号：TG454[金属学及工艺—焊接]