有源器件光芯片的应用研究  

作　　者：施明伟 蔡寅舟 杨晓佳 

机构地区：[1]江苏亨通光网科技有限公司,江苏吴江215200

出　　处：《现代传输》2018年第2期61-66,共6页Modern Transmission

摘　　要：本文介绍了有源器件光芯片发展的历程,从上世纪出现的分立有源器件发展为现今的集成有源光芯片,通过对比分析分立混合集成有源光芯片和单片集成有源光芯片的特点,着重阐述了硅基单片集成有源光芯片未来发展的优势和挑战。通过对现今最广泛使用的三大光芯片集成技术——Si OB(硅光平台集成技术)、PIC(光子集成回路技术)、OEIC(光电子集成回路技术)原理、特点、发展优势的介绍,和对有源器件光芯片的代表性产品——光模块、有源光缆的应用介绍,得出基于OEIC技术的器件代表了光集成有源器件未来的结论。The artical introduced the development of active optoelectronic chips.Discrete active devices emerged from the last century have developed into today's integrated active optical chip.Through the comparative analysis of the features of discrete hybrid integrated active optical chip and monolithic integrated active optical chip,focuses on the advantages and challenges of the future development of silicon-based monolithically integrated active optical chips.Through the introduction of the three most widely used integrated technologies of optical chips,SiOB(silicon optical platform integration),PIC(photonic integrated circuit),OEIC(optoelectronic integrated circuit technology),as well as the introduction of the representative products of active device optical chip,the conclusion that OEIC-based device represents the future of light-integrated active devices is earnd.

关 键 词：有源器件光芯片 硅基 光集成技术 OEIC 

分 类 号：TN40[电子电信—微电子学与固体电子学]