温度循环对SMT焊点的影响分析  

Analysis of Influence of Temperature Cycle on SMT Solder Joint

作　　者：王威 马喜宏[2] 秦立君 何程 WANG Wei;MA Xihong;QING Lijun;HE Cheng(School of Instrument and Electronics,North University of China,Taiyuan 030051,China;Key Laboratory of Instrumentation Science and Dynamic Measurement of Ministry of Education,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学仪器与电子学院,太原030051 [2]中北大学仪器科学与动态测试教育部重点实验室,太原030051

出　　处：《电子器件》2018年第1期1-7,共7页Chinese Journal of Electron Devices

基　　金：国家自然科学基金项目(51075374)

摘　　要：随着表面贴装技术广泛地应用于微电子电路,使得研究环境对焊点的可靠性影响等问题越来越重要,尤其是低周热疲劳问题。通过-40℃~125℃和0~100℃温度循环情况下的印刷电路板焊点拉拔实验及其实验数据找出温度变化对焊点失效的影响情况。分析得出随着温度循环数的增加,平均拉拔力从15 N减小到5 N,且温差越大拉拔力减小的速率越快,即实验1明显比试验2拉拔力下降速度快并且最终能减小到3.52 N。分析其原因可知在经过长期的热循环,焊点和焊盘发生了部分开裂,但并没有导致电性失效。焊点部分开裂,使拉拔过程,在施加很小的力的情况下即使焊点发生失效。With the wide application of surface mount technology in microelectronic circuits,the research on the reliability of solder joints is becoming more and more important,especially in low temperature thermal fatigue problems.The influence of temperature change on the failure of solder joint was found by the test of the solder joint of the printed circuit board and its experimental data at-40℃~125℃and 0~100℃temperature cycle.The average pull-out force decreases from 15 N to 5 N with the increase of the number of temperature cycles,and the faster the temperature difference variation is,the faster the tensile force decreases,that is,experiment 1 is significantly faster than that of experiment test 2 eventually reduced to 3.52 N.The reason for the analysis shows that after a long period of thermal cycling,the solder joint and the pad partially cracked,but did not lead to electrical failure.The solder joint is partially cracked so that the drawing process makes the solder fail in the case of applying a small force.

关 键 词：微电子技术 SMT焊点 低周热循环实验 可靠性 温度 

分 类 号：V416.5[航空宇航科学与技术—航空宇航推进理论与工程] TG44[金属学及工艺—焊接]