一种高效提取SMT焊点质量信息的方法  

A Rapid and Efficiently Method for Extracting Quality Information of SMT Solder Chip Components

作　　者：吴媛 杨富超 WU Yuan(Henan Institute of Technology,Xinxiang 453003,China)

机构地区：[1]河南工学院计算机科学与技术系,河南新乡453003 [2]河南工学院机电工程系,河南新乡453003

出　　处：《河南机电高等专科学校学报》2018年第1期5-8,15,共5页Journal of Henan Mechanical and Electrical Engineering College

基　　金：2015年度河南省高等学校重点科研项目(15A520064);新乡市重点科技攻关计划项目(ZG13018);河南省2013年省级教改项目"机电一体化技术专业"综合改革试点项目(87)

摘　　要：以嵌入式为开发平台,在五线法的基础上,提出了一种高效提取SMT片式元器件焊点质量信息的方法。通过多光束的图像采集,建立数据搜索的新存储方法,利用曲线、曲面拟合恢复焊点三维形态并切片处理,获得关键截面信息。该方法能快速有效获取焊点的3D形态参数,为焊点质量好坏的智能鉴定、质量统计等提供可靠数据。First,the rapid extraction methods are based on the embedded development platform.The multi-beam into image acquisition on the basis of the five line method and the pre-processing program of the image the is appropriate the chip Components solder is selected,as well as establishing in particular the storage method of the new data search aiming at more beams to build new data search method.Finally,the three-dimensional form of the solder joints can be restored through curve and curved surface fitting and sliced for key section information.The methods can effectively extract the 3D shape parameters of the solder joint,reduce the failure rate,improved the assembly quality and product reliability.

关 键 词：SMT焊点 嵌入式 多光束 数据搜索 快速提取 

分 类 号：TP183[自动化与计算机技术—控制理论与控制工程]