树脂金刚石切割线切割硅片延时现象分析  

Analysis on delay phenomenon of resin diamond wire when slicing silicon

作　　者：高伟[1] 董夫宁 李腾[1] 马伯江[1] 王东雪 GAO Wei;DONG Funing;LI Teng;MA Bojiang;WANG Dongxue(College of Electromechanical Engineering,Qingdao University of Science and Technology,Qingdao 266061,Shandong,China;Qingdao Gaoce Technologies IncQingdao 266A14,Shandong,China)

机构地区：[1]青岛科技大学机电工程学院,山东青岛266061 [2]青岛高测科技股份有限公司,山东青岛266114

出　　处：《金刚石与磨料磨具工程》2018年第2期66-70,共5页Diamond & Abrasives Engineering

基　　金：山东省自然科学基金(项目编号:ZR2017MEE076)

摘　　要：为消除树脂金刚石线切割硅片的延时现象,建立切割模型研究单颗金刚石树脂层退让性,分析退让量δ和切割线弓A的关系。理论研究表明:线弓的变化量和树脂层的退让量正相关。选不同硬度的树脂按相同工艺制备金刚石切割线,并进行单晶硅切割对比实验,用扫描电镜观察切割后的树脂金刚石线锯。发现:在相同的切割条件下,以较软的树脂制成的金刚石切割线其退让行为显著、线弓大、切割时间长。使用高强树脂,可增加树脂层的固化强度,降低树脂层的退让性,有效解决切割延时问题。To erase the delay phenomenon of resin diamond wire slicing silicon,a slicing model was established to study the deformability of singCe diamond in resin layer.The relationship between shittδand the bending arc A was analyzed.Theoretical research indicates that there betweenδand A.Diamond wires were then made at the same condition but with resins of different hardness and the contrast tests were implemented.After slicing,the wires were observed by SEM.It is found that at the same slicing condition,diamond wire with softer resin deforms more,and thus with bigger bending arc and longer slicing time.In conclusion,resin with high strength will add the curing strength of resin layer and decrease the deformability,thus efficiently solving the slicing delay problem.

关 键 词：树脂金刚石切割线 多线切割 硅片 

分 类 号：TQ164[化学工程—高温制品工业] TG74[金属学及工艺—刀具与模具]