电解铜箔黑化用电镀钴–锌合金工艺  被引量:4

Cobalt–zinc alloy electroplating process for blackening of electrolytic copper foils

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作  者:王其伶 孙云飞 王学江 宋佶昌 杨祥魁 WANG Qi-ling;SUN Yun-fei;WANG Xue-jiang;SONG Ji-chang;YANG Xiang-kui(Copper Foil R&D Center,Shandong Jinbao Electronics Co.,Ltd.,Zhaoyuan 265400,China)

机构地区:[1]山东金宝电子股份有限公司铜箔研发中心,山东招远265400

出  处:《电镀与涂饰》2018年第8期338-343,共6页Electroplating & Finishing

摘  要:采用硫酸盐钴–锌合金镀液对电解铜箔进行电镀黑化处理。研究了镀液中钴离子、锌离子和黑化剂(由硫氰酸钾、柠檬酸、乙醇酸等组成)的含量以及工艺参数对镀层颜色的影响。得到最优的钴–锌合金电镀工艺为:Co^(2+)6 g/L,Zn^(2+)0.4~0.6 g/L,黑化剂50 m L/L,p H=1.5~1.9,温度40°C,电流密度10 A/dm^2,时间8 s。经该工艺处理的铜箔的L~*为28.9,具有良好的结合力和蚀刻性。Electrolytic copper foils were blackened by electroplating of Co-Zn alloy in a sulfate bath.The effects of the contents of cobalt ions,zinc ions,and blackening agent(comprising potassium thiocyanate,citric acid,and glycolic acid)in the bath as well as process parameters on the color of electroplated Co-Zn coating were studied.The optimal process conditions for Co-Zn alloy electroplating were determined:Co2+6 g/L,Zn2+0.4-0.6 g/L,blackening agent 50 mL/L,temperature 40°C,pH 1.5-1.9,current density 10 A/dm2,and time 8 s.The copper foil treated under the optimal process conditions has a L*value of 28.9 as well as good adhesion and etchability.

关 键 词:电解铜箔 黑化 电镀 钴-锌合金 结合力 蚀刻性 

分 类 号:TQ153.2[化学工程—电化学工业]

 

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