电镀参数对薄膜电路镀镍层性能的影响  

Effects of Electroplating Parameter on the Performance of Nickel-plating Layer on Thin Film Circuits

作　　者：孙林 谢新根[1] 程凯[1] 刘玉根[1] 

机构地区：[1]中国电子科技集团公司第五十五研究所,南京210016

出　　处：《电镀与精饰》2018年第8期28-33,共6页Plating & Finishing

摘　　要：选用不同的电流密度、温度及整流器输出波形进行了薄膜电路镀镍实验,以此来研究电镀参数对薄膜电路镀镍速率、镀镍层表面形貌、粗糙度、微带线厚宽比等性能带来的影响。结果表明,随着电流密度的增大,薄膜电路的镀镍速率会逐渐增大;镀层表面缺陷会先减少后增多,镀层粗糙度也会先减小后增大,微带线厚宽比会先增大后减小;随着镀液温度的升高,薄膜电路的镀镍速率会逐渐增大,镀层表面缺陷会先减少后增多,镀层粗糙度会先减小后增大,微带线厚宽比会先增大后减小;选用不同的整流器输出波形镀镍时,在高低自由波及脉冲波形条件下,薄膜电路分别具有最高与最低的镀镍速率;高低自由波条件下制备得到的镀镍层缺陷较多,状态较差,单相全波整流波形与脉冲波形条件下镀层表面缺陷较少,形貌较好;高低自由波及单相全波整流波形分别具有最大及最小的镀层粗糙度;高低自由波及单相全波整流波形条件下,薄膜电路微带线分别具有最小及最大的厚宽比。Nickel plating experiments were carried out at different current density,temperatures and output waveforms,and effects of electroplating parameter on the electroplating rate,surface morphology,roughness,thickness-width ratio and uniformity of thin film circuits were investigated.The results show that as the current density and temperature increases,the electroplating rate will gradually increase,the surface defects and roughness of the coating will first decrease and then increase,and the width ratio will first increase and then decrease.When different output waveforms were selected,the HL and CHOP showed the highest and lowest electroplating rate.More defects can be observed on the coatings prepared under H-L waveforms,while the surface defects of the coating prepared under S.W and CHOP waveforms are less and the morphology is better.Coatings prepared under H-L and S.W have the largest and minimum roughness and the obtained thin film circuit microstrip line possesses the smallest and the largest thickness to width ratio.

关 键 词：薄膜电路 电流密度 温度 输出波形 镀镍 性能 

分 类 号：TQ153.12[化学工程—电化学工业]