封装锡合金焊料Ⅰ型断裂特性的实验研究  

Experiment research of packing solders on mode Ⅰ fracture characteristics

作　　者：李英梅[1] 王超杰 李东[1] Li Yingmei;Wang Chaojie;Li Dong(College of Science,Northeastern University,Shenyang 110819,China)

机构地区：[1]东北大学理学院,沈阳110819

出　　处：《材料与冶金学报》2018年第3期228-232,238,共6页Journal of Materials and Metallurgy

基　　金：国家自然科学基金项目(11304033)

摘　　要：采用铜-焊料-铜双悬臂梁焊接试件,利用联动夹具和非接触式引伸计,对锡铅焊料Sn63Pb37和无铅焊料Sn Ag Cu305进行了25℃温度下的I型断裂实验,得到了焊料I型断裂时的载荷-张开位移曲线,观察了焊料的起裂、裂纹扩展、断裂等实验现象,采用双材料弹性基柔度法,计算了焊料的I型能量释放率.实验结果表明,两种焊料的初始能量释放率基本相同,均为800~900 N/m,但无铅焊料有较长的亚临界裂纹扩展阶段,其开裂载荷约为最大载荷的80%左右;能量释放率饱和值比初始值高1. 4倍,表现出更好的抵抗裂纹扩展的特性.By using linkage jig and noncontact extensometer,the mode I fracture experiments of Sn63Pb37 and Pb-free SAC305 solders was carried out at 25℃by loading Cu-solder-Cu double cantilever beam(DCB)welding specimen.The load-opening displacement curves were obtained for mode I fracture of the two solders,and the fracture phenomena were observed,such as crack initiation,propagation and fracture etc.The modeⅠcritical energy release rates of the two solders were calculated by using the double elastic base flexibility method.The experiment results showed that the initial energy release rates of the two solders are both about 800~900 N/m.A long crack subcritical propagation is observed for SAC305 solder,its initial crack load is about 80%of the maximum load.The saturation value of the critical energy release rate is 1.4 times higher than its initial value,certifying a better resistance to crack propagation in Pb-free solder.

关 键 词：焊料 能量释放率 断裂特性 双悬臂梁试件 亚临界扩展 

分 类 号：TG425[金属学及工艺—焊接]