集成电路制造业用高分子聚合物抛光垫专利分析  

Patent analysis on polymeric polishing pad for integrated circuit manufacturing

作　　者：刘国瑞 刘玉岭 石瑛 王艳梅 牛新环 张文倩 LIU Guo-rui;LIU Yu-ling;SHI Ying;WANG Yan-mei;NIU Xin-huan;ZHANG Wen-qian(School of Electronics and Information Engineering,Hebei University of Technology,Tianjin 300130,China)

机构地区：[1]河北工业大学电子信息工程学院,天津300130 [2]天津城建大学计算中心,天津300380 [3]集成电路材料产业技术创新战略联盟,北京100089

出　　处：《电镀与涂饰》2018年第17期789-799,共11页Electroplating & Finishing

基　　金：国家中长期科技发展规划02科技重大专项资助项目(2016ZX02301003-004-007);河北省研究生创新资助项目(220056);河北省青年自然科学基金资助项目(F2015202267);天津市自然科学基金资助项目(16JCYBJC16100)

摘　　要：借助Questel公司的Orbit专利数据库,对近27年内12 087个与化学机械抛光(CMP)用高分子聚合物抛光垫相关的专利族(其中含有2918个核心专利族)进行分析,得出此领域全球专利申请量、申请趋势、专利法律状态、专利公开区域、专利权人分布、专利引用状况、专利核心概念、专利地图、IPC(国际专利分类)分布、顶级专利权人技术定位等重要信息。考察了中国内地在该领域的专利情况,为中国集成电路产业全球战略布局提供参考。The patents related to polymeric pads for chemical mechanical polishing(CMP)applied in the past 27 years were analyzed.In total 12 087 patent families were found from the Questel’s Orbit patent search database,out of which 2 918 were core patent families.The global patent application quantity,application trend,legal status,publication area distribution,assignee distribution,patent citation,core patents,patent landscape,IPC(international patent classification)distribution,and top assignees’technical positioning were analyzed.The patent application situation in China's Mainland was studied to give a guidance for the global strategic layout of Chinese integrated circuit industry.

关 键 词：集成电路 化学机械抛光 高分子聚合物抛光垫 专利分析 技术定位 

分 类 号：TN305.2[电子电信—物理电子学]