3D设计技术在SiP中的应用  

The application of 3D design technologies in SiP

作　　者：李扬 Li Yang(AcconSys Technology Co.,Ltd.,Beijing 100045,China)

机构地区：[1]奥肯思科技有限公司,北京100045

出　　处：《电子技术应用》2018年第9期39-43,共5页Application of Electronic Technique

摘　　要：SiP(System-in-Package)系统级封装技术是最新的微电子封装和系统集成技术,目前已成为电子技术发展的热点。SiP最鲜明的特点就是在封装中采用了3D(Three Dimensions)技术,通过3D技术,可以实现更高的系统集成度,在更小的面积内封装更多的芯片。从设计角度出发,介绍了应用在SiP中的3D设计技术,包括3D基板设计技术和3D组装设计技术,阐述了3D设计的具体思路和方法,可供工程师在设计3D SiP时参考。SiP(System-in-Package)is the latest microelectronic packaging and system integration technology,now it has become a hot spot in the development of electronic technology.The most distinctive feature of SiP is the use of 3D(Three Dimensions)technology in package.Through 3D technology,we can achieve higher system integration and package more chips in a smaller area.From the design point of view,this paper sets forth the 3D design technology applied in SiP,including 3D substrate design technology and 3D assembly design technology,and expounds the specific ideas and methods of 3D design,which can be used for reference by engineers in designing 3D SiP.

关 键 词：系统级封装 3D SIP 3D设计技术 3D基板设计 3D组装设计 

分 类 号：TN603.5[电子电信—电路与系统]