粘胶材料参数对微加速度计零位温度漂移的影响研究  

Investigation of Material Properties of Die Attach Adhesive on Thermal Bias Drift of MEMS Accelerometer

作　　者：彭鹏[1] 彭倍[1] 周吴[1] 于慧君[1] 曲昊[1] PENG Peng;PENG Bei;ZHOU Wu;YU Hui-jun;QU Hao(College of Mechatronics Engineering,University of Electronic Science and Technology of China,Chengdu 611731.China)

机构地区：[1]电子科技大学机械电子工程学院,四川成都611731

出　　处：《仪表技术与传感器》2018年第9期8-11,共4页Instrument Technique and Sensor

基　　金：国家自然科学基金项目(U1530132)

摘　　要：粘胶材料常用于实现微加速度计芯片与基底的粘接。为了研究粘胶材料参数对微加速度计零位温度稳定性的影响,首先根据微加速度计理论输出模型,分析了影响零位温度漂移的关键变形。其次,基于典型的芯片-粘胶-基底热变形解析模型,研究了粘胶的弹性模量、热膨胀系数和厚度对该变形的影响,并且理论计算了在常用材料参数范围内,微加速度计的零位温度漂移量。研究表明,弹性模量对零位温漂影响最大,采用软胶(弹性模量小)粘贴能够有效地提高微加速度计的温度稳定性。最后,利用2种粘胶分别粘贴微加速度计,通过比较这2类微加速度计的温漂测试结果,实验验证了结论的正确性。Adhesive materials are commonly used in the packaging of microelectromechanical(MEMS)accelerometer to attach the chip die on the substrate.In order to investigate the material properties of the adhesive on the thermal stability of bias for MEMS accelerometer,the influencing factor on the output of the sensor under temperature change was analyzed based on a theoretical model.Furthermore,the effects of Young s modulus,coefficient of thermal expansion and thickness of the adhesive on the factor were studied according to an analytical model for the thermal deformation of chip-adhesive-substrate assembly,and then the bias of the accelerometers with different adhesive parameters were calculated.The theoretical results indicated that Young s modulus has the biggest influence on the bias,and a soft adhesive can substantially improve the thermal stability.Finally,the thermal bias drifts of the accelerometers with two types of die attach adhesives were tested and compared to validate the correctness of the analytical results proposed in this study.

关 键 词：粘胶 材料参数 微加速度计 零位 温度漂移 

分 类 号：TH824[机械工程—仪器科学与技术]