一种新型的基于V_(ce-on)的IGBT模块结温实时估测法  

A novel real-time estimation method of junction temperature based on V_(ce-on) for IGBT module

作　　者：文星 杜明星[1] 景雷[1] 魏克新[1] Wen Xing;Du Mingxing;Jing Lei;Wei Kexin(Tianjin Complex System Control Theory and Application Laboratory,Tianjin University of Technology,Tianjin 300384,China)

机构地区：[1]天津理工大学天津市复杂系统控制理论及应用实验室,天津300384

出　　处：《电测与仪表》2018年第19期106-111,共6页Electrical Measurement & Instrumentation

基　　金：天津市自然科学基金项目(17JCYBJC21300);国家重点研发计划"新能源汽车"重点专项(2017YFB0102504)

摘　　要：文中提出了一种新型的利用通态V_(ce-on)实时估测结温的方法。首先分析了被测IGBT模块通态V_(ce-on)与温度的相关性,然后通过软件提取了模块的互连材料参数,该方法大大降低了实验成本,操作也更加简便。最为重要的是,充分考虑了内部材料电阻对IGBT模块结温的影响,并对其进行了补偿。最后,通过比较红外摄像仪测量结果和实时估测结温验证了该方法的有效性。A novel method for real-time estimation of the junction temperature using on-state V ce-on is proposed in this paper.The correlation between on-state V ce-on and the temperature of IGBT module is analyzed firstly,and then,the parameters of the interconnection materials are extracted using simulation software,which greatly reduces the experimental cost and the operation is easier.Most importantly,the influence of interconnection material resistance on IGBT module is fully taken into account,and compensation is given.Finally,this paper proves the validity of the proposed method by comparing the measurement results by infrared camera with the real time estimation results.

关 键 词：IGBT模块 通态Vce-on 结温 参数提取 

分 类 号：TM933[电气工程—电力电子与电力传动]