导电聚吡咯在印制电路板金属化中的研究进展  

Progress of Conductive Polypyrrole in Metallization of Printed Circuit Boards

作　　者：喻涛 陈苑明 李高升 何为 左林森 李清华 艾克华 彭勇强 YU Tao;CHEN Yuanming;LI Gaosheng;HE Wei;ZUO Linsen;LI Qinghua;AI Kehua;Peng Yongqiang(School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 611731,China;Sichuan Innoquick Electronics Co.,Ltd,Suining 629000,China;Netron Soft-Tech(Zhuhai)Co.,Ltd,Zhuhai 519040,China)

机构地区：[1]电子科技大学材料与能源学院,四川成都611731 [2]四川英创力电子科技股份有限公司,四川遂宁629000 [3]奈电软性科技电子(珠海)有限公司,广东珠海519040

出　　处：《电镀与精饰》2018年第11期22-26,共5页Plating & Finishing

基　　金：广东省科技计划项目(No.2016B090918095)

摘　　要：聚吡咯具有合成简单、稳定性好、电导率高等优点,其作为导电聚合物直接电镀体系之一发展迅速。本文概述了聚吡咯的导电性、合成方法及其在印制电路板金属化中的应用,指出了聚吡咯直接电镀技术的发展方向。Polypyrrole has the advantages of simple synthesis,good stability and high electrical conductivity.It has developed rapidly as one of the direct electroplating systems for conductive polymers.The conductivity,synthesis method of polypyrrole and its application in the metallization of printed circuit boards are reviewed.At the same time,the development direction of polypyrrole direct plating technology is pointed out.

关 键 词：聚吡咯 印制电路板 直接电镀 

分 类 号：TG178.2[金属学及工艺—金属表面处理]