抗坏血酸对镍-钼合金电沉积的影响  

Effect of ascorbic acid on electrodeposition of nickel-molybdenum alloy

作　　者：齐海东 卢帅 郭昭 周宗熠 李运刚 杨海丽 QI Hai-dong;LU Shuai;GUO Zhao;ZHOU Zong-yi;LI Yun-gang;YANG Hai-li(College of Metallurgy and Energy,North China University of Science and Technology,Key Laboratory of the Ministry of Education for Modern Metallurgy Technology,Tangshan 063210,China)

机构地区：[1]华北理工大学冶金与能源学院,现代冶金技术教育部重点实验室,河北唐山063210

出　　处：《电镀与涂饰》2018年第21期965-970,共6页Electroplating & Finishing

基　　金：国家自然科学基金(51774142)。

摘　　要：在玻碳旋转圆盘电极(RDE)上,采用循环伏安(CV)、电化学阻抗谱(EIS)、计时电流(CA)等电化学测量方法研究了抗坏血酸对Ni–Mo合金在0.50 mol/L NiSO_4·6H_2O+0.60 mol/L柠檬酸铵+0.05 mol/L Na_2Mo O_4·2H_2O的镀液(pH=3.0)中电沉积行为的影响。结果表明:Ni–Mo合金电沉积是受动力学和扩散混合控制的不可逆过程,随着镀液中抗坏血酸含量的增大,沉积过程受扩散控制的程度变大;共沉积速率的决定步骤是Mo的还原;抗坏血酸能够增强阴极极化;Ni–Mo合金的形核速率提高,并且合金的成核基本符合连续成核机制。The effect of ascorbic acid on electrodeposition behavior of Ni–Mo alloy in a bath comprising 0.50 mol/L NiSO4?6H2O,0.60 mol/L ammonium citrate,and 0.05 mol/L Na2MoO4?2H2O was studied on glassy carbon rotating disk electrode(RDE)by cyclic voltammetry(CV),electrochemical impedance spectroscopy(EIS),and chronoamperometry(CA).The results showed that the electrodeposition of Ni–Mo is an irreversible process controlled by both dynamics and diffusion.The effect of mass transfer on alloy deposition becomes more obvious with the increasing of ascorbic acid content in the electrolyte.The rate-determining step for the whole alloy deposition reaction is the reduction of Mo.Ascorbic acid plays a role in enhancing the cathodic polarization and increasing the alloy nucleation rate.The nucleation of alloy approaches the progressive nucleation mechanism.

关 键 词：镍-钼合金 电沉积 抗坏血酸 阴极极化 电化学 

分 类 号：TQ153.2[化学工程—电化学工业]