一种基于柔性基底的薄膜体声波谐振器  

A Thin Film Bulk Acoustic Resonator Based on Flexible Substrate

作　　者：杨泰 张根 秦康宁 杜波[1,2] 蒋欣[1,2] 马晋毅[2] 钟慧[1] 石玉[1] YANG Tai;ZHANG Gen;QIN Kangning;DU Bo;JIANG Xin;MA Jinyi;ZHONG Hui;SHI Yu(State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China;The 26th Institute of China Electronics Technology Group Corporation, Chongqing 400060, China)

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]中国电子科技集团公司第二十六研究所,重庆400060

出　　处：《压电与声光》2018年第6期901-904,共4页Piezoelectrics & Acoustooptics

基　　金：国家自然基金资助项目(61471086);中国工程物理研究院超精密加工技术重点实验室开发基金课题项目(2014KZ001)

摘　　要：为了能有效解决柔性基底体声波谐振器热稳定性不足及功率容量不足等问题,该文提出了一种新型的基于柔性基底的薄膜体声波谐振器。该谐振器的硅衬底上开设有一定数量的垂直上凸型结构,该结构既能有效抑制寄生模量,又能减小器件最高稳态温度和最大热应力。通过有限元分析软件Comsol Multiphics对谐振器进行仿真,结果表明,器件每增加一个上凸型结构,其最高稳态温度下降了4℃,最大热应力下降了1×104 GPa。与以往的柔性基底薄膜体声波谐振器相比,它具有更好的热传导能力和热应力稳定性。In order to solve the problems of insufficient thermal stability and insufficient power capacity of the flexible base film bulk acoustic resonator,a new type of thin film bulk acoustic resonator based on flexible substrate is proposed in this paper.The silicon substrate of resonator has a certain number of embossments;the structure can effectively suppress the parasitic resonance mode,but also can reduce the device maximum steady-state temperature and maximum thermal stress.The simulation results of the finite element analysis software Comsol Multiphics show that the maximum steady-state temperature decreases by 4℃for each additional embossment,and the maximum thermal stress decreases by 1×10^4 GPa.Compared with the conventional flexible substrate thin film bulk acoustic resonator,it has better thermal conductivity and thermal stress stability.

关 键 词：柔性基底 薄膜体声波谐振器 Comsol 大功率 热学分析 微机电系统(MEMS) 

分 类 号：TN713.2[电子电信—电路与系统] TN38