微系统热管理技术的新发展  

New Development of Thermal Management Technology for Microsystems

作　　者：余怀强[1] 唐光庆[2] 桂进乐 王腾[1] 黄波 邓立科[1] 蒋创新[1] YU Huaiqiang;TANG Guangqing;GUI Jinle;WANG Teng;HUANG Bo;DENG Like;JIANG Chuangxin(The 26th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060,China;Military Representative Office of the PLA at Chongqing Gas Compressor Factory, Chongqing 400060, China)

机构地区：[1]中国电子科技集团公司第二十六研究所,重庆400060 [2]中国人民解放军驻重庆气体压缩机厂军事代表室,重庆400060

出　　处：《压电与声光》2018年第6期931-935,共5页Piezoelectrics & Acoustooptics

摘　　要：多功能高度集成的微系统技术对信息系统的通信、传感、处理和执行等方面产生了很大的影响,而热管理问题却一直制约着微系统技术的发展。该文介绍了美国在微系统热管理技术方面的项目研究计划及基于热传导与液冷技术的微系统热管理技术的新进展,提出了一种基于压电驱动的主动微系统高效热管理方法,并通过搭建试验样机完成原理性测试验证。该技术主要针对如微波毫米波大功率"瓦片式"T/R(收发)组件等射频微系统热管理应用。The highly integrated multifunctional microsystem technology has made a great impact on communication,sensing,processing and actuating of information systems.However,the thermal management issues of microsystems restrict its further development.This paper presents the initiatives of America's thermal management for microsystems and reviews the advances of thermal management technology for microsystems based on heat conduction and liquid cooling techniques.An active and efficient thermal management method for microsystems based on piezoelectric actuation is also presented in this paper,and the principle test verification has been implemented by setting up the test prototype.The proposed technology can be applied to the thermal management of RF microsystems such as microwave/millimeter wave tile T/R module with high power.

关 键 词：热管理 微系统 热流密度 压电驱动 内嵌微流道 

分 类 号：TN713[电子电信—电路与系统]