磁控溅射快速沉积钽涂层的组织及性能  

Microstructure and Properties of Ta Coatings Rapidly Deposited by Magnetron Sputtering

作　　者：陈汉宾[1] 陈大军[1] 李忠盛[1] 吴护林[1] 丛大龙 李立[1] 张隆平[1] CHEN Hanbin;CHEN Dajun;LI Zhongsheng;WU Hulin;CONG Dalong;LI Li;ZHANG Longping(No.59 Institute of China Ordnance Industry,Chongqing 400039,China)

机构地区：[1]中国兵器工业第五九研究所,重庆400039

出　　处：《兵器装备工程学报》2018年第11期156-160,共5页Journal of Ordnance Equipment Engineering

摘　　要：探索提高磁控溅射钽涂层沉积速率的方法,研究了沉积工艺如靶与基材相对关系、靶基间距、基体温度、沉积电流等参数对钽涂层的沉积速率、组织和性能的影响。结果表明靶基间距降低到20 mm,二者正对时沉积速率最高,达20μm/h,能制备出20μm厚钽涂层;基材温度为室温时,获得a相和β相组成的双相结构,提高基材温度到200℃时,可获得α相(脆性小)为主的单相组织;磁控溅射沉积的厚钽涂层内产生压应力,最大达621 MPa,厚钽涂层具有较高的显微硬度,为不锈钢基体的4倍。We explored the way to improve the deposition rate of Ta coatings prepared by magnetron sputtering,for obtaining thick Ta coatings.The effect of process parameters,such as relation of target and substrate,target-to-substrate distance,substrate temperature,electric current on deposition rate,microstructure,and properties of Ta coatings were investigated.The experimental results show that the maximal deposition rate reaches20μm/h when the target and substrate are face to face and the target-to-substrate distance reduces to20mm.Thick Ta coatings can be prepared by magnetron sputtering.Theαandβdouble phase microstructure is obtained when the substrate temperature is at ambient,and the low brittlenessαphase is obtained at elevated temperature.The stress of deposited Ta coatings is compressive,and the maximal value is about621MPa of thick Ta coatings.The microhardness of Ta coatings is very high,and is four times larger than that of stainless steels substrate.

关 键 词：磁控溅射 沉积速率 厚钽涂层 组织 应力 

分 类 号：TJ04[兵器科学与技术—兵器发射理论与技术]