一种添加氧化石墨烯的高导热环氧型覆铜板  

A high thermal conductivity epoxy type Copper Clad Laminate with graphene oxide

作　　者：陈冠刚 刘镇权 吴培常 林周秦 Chen Guangang;Liu Zhenquan;Wu Peichang;Lin Zhouqin

机构地区：[1]广东成德电子科技股份有限公司,广东佛山528300

出　　处：《印制电路信息》2018年第12期17-22,共6页Printed Circuit Information

摘　　要：介绍添加氧化石墨烯的高导热环氧型覆铜板制备过程及其性能测试。这种板材绝缘电阻高、散热快等优点,更加适应于大功率多层PCB的需要,是一种很有发展前途的板材。This paper introduced in detail about the manufacturing process of high thermal conductivity for FR-4copper clad laminate and relative functional test.This material has higher insulated resistance,higher thermal conductivity and etc.which can be fit for great power MLB requirement.It is a kind of new material developed.

关 键 词：覆铜板 氧化石墨烯 导热系数 导热机理 

分 类 号：TN41[电子电信—微电子学与固体电子学]