X波段功率放大器封装外壳焊接性研究  

Solderability coating technology for X band power amplifier package housing

作　　者：李箕云 禹胜林[1] 兰晓东 陈杰 岳燕星[3] Li Jiyun;Yu Shenglin;Lan Xiaodong;Chen Jie;Yue Yanxing(Nanjing University of Information Science and Technology,Nanjing 210044,China;Chengdu Yaguang Electronics Limited Company,Chengdu 610059,China;Heilongjiang Polytechnic,Harbin 150080,China)

机构地区：[1]南京信息工程大学,南京210044 [2]成都亚光电子股份有限公司,成都610059 [3]黑龙江职业学院,哈尔滨150080

出　　处：《焊接》2018年第12期21-24,66,共5页Welding & Joining

摘　　要：介绍了X波段功率放大器封装外壳应用的特点及应用,选用了AlSi为外壳材料,镀金层以其良好的可焊接性和防腐性得到了广泛的应用,但镀层必须均匀、不变色、不起皮、不起泡,因此,必须对AlSi外壳材料的镀金质量严格控制。研究实验表明AlSi外壳材料镀层的质量受材料制备粉末粒度的影响较大,试验中比较了粉末粒度为13. 19μm和4. 64μm的镀层形貌影响,当制备粉末粒度为13. 19μm时明显不均匀,出现断层,厚度较小,无法实现实用的镀层,而4. 64μm制备粉末的材料镀层则均匀镀层,厚度适中。其次在相同制备粉末粒度条件下,电镀电流密度对材料镀层质量也有一定的影响,当电镀电流密度为20 m A/cm^2时,可以实现相对比较均匀的镀层,并且镀层的缺陷较少,当把电流密度增加到25 m A/cm^2时,镀层明显不均匀,缺陷较多。研究结果表明采用4. 64μm制备粉末的材料、电镀电流密度为20 m A/cm^2时,AlSi外壳材料的镀层连续、完整,其焊接性测试结果满足MIL-STD-883的标准要求。研究结果为AlSi外壳材料的广泛应用提供了技术保障,对微波器件、组件的发展具有十分重要的意义。The characteristics and application of package case of X-band power amplifier were introduced. ALSi is selected as shell material.Gold plating layer has been widely used for its good weldability and corrosion resistance. However,the coating must be uniform,colourless,non-skinning and non-foaming. Therefore,the gold plating quality of ALSi shell material must be strictly controlled. The results show that the coating quality of ALSi shell material is greatly affected by the powder size. The morphology of the coating with powder size of 13. 19 μm and4. 64 μm was compared in the experiment. When the powder size is 13. 19 μm,the coating is obviously uneven,faults occur and the thickness is small,which makes it impossible to achieve practical coating. However,4. 64 μm powder is uniformly plated and has a moderate thickness.Secondly,with the same preparation powder size,the plating current density also has a certain impact on the quality of the coating. When the plating current density is 20 m A/cm^2,a relatively uniform coating can be achieved,and the defects of the coating are less. When the current density is increased to 25 m A/cm^2,the coating is obviously inhomogeneous and has more defects. The results show that the coating of ALSi shell material is continuous and complete when the powder material is prepared with 4. 64 μm powder at the plating current density of 20 m A/cm^2. The weldability test results meet the standard requirements of MIL-STD-883. The results of the studies provide a technical guarantee for the wide application of ALSi shell materials,and are of great significance for the development of microwave devices and components.

关 键 词：封装 镀金层 放大器 电流密度 粉末粒度 

分 类 号：TG443[金属学及工艺—焊接]