WCu/MoCu电子封装材料的研究现状与发展趋势  

The Current State and Development Trend of WCu/MoCu Electronic Packaging Materials

作　　者：王新刚[1] 张润梅 陈典典 曾德军[1] 许西庆 袁战伟[1] WANG Xingang;ZHANG Runmei;CHEN Diandian;ZENG Dejun;XU Xiqing;YUAN Zhanwei(School of Materials Science and Engineering,Chang an University,Xi’an 710061,China)

机构地区：[1]长安大学材料科学与工程学院,陕西西安710061

出　　处：《中国材料进展》2018年第12期1010-1016,1047,共8页Materials China

基　　金：国家重点研发计划项目(2017YFB0406100).

摘　　要：电子设备集成度和运行速度的不断提高以及大功率芯片的使用,对电子封装材料的性能提出了更高的要求。WCu/MoCu合金作为第二代电子封装材料,尽管已经实现产业化,但其未来发展正面临极大的挑战,既有可能持续应用于封装领域,也有可能在与其它材料的竞争中被淘汰。在现有技术的基础上,使WCu/MoCu复合材料充分融合各组元的优点,以获得具有高热导率、低热膨胀系数以及良好力学性能的电子封装材料,已成为迫在眉睫的工作。综述了电子封装材料的性能指标,以及WCu/MoCu合金的热学性能与制备工艺,并针对高热导率这一关键性能对其发展趋势进行了展望。Due to the increase of integration and running speed in electronic equipments,along with the employment of high power chips,electronic packaging materials with better properties are claimed.As the second-generation electronic packaging materials,WCu/MoCu alloys are confronted with great challenges in the future development,even though their industrialization has been realized.On the one hand,they are possible to continue their application in electronic packaging.On the other hand,they may be eliminated in the competition against other materials.Therefore,it is imperative to fully take advantage of each component in WCu/MoCu alloys based on the current technology,and to obtain electronic packaging materials with high thermal conductivity,low coefficient of thermal expansion and superior mechanical properties.In this paper,the performance index of electronic packaging materials are introduced,and the thermal properties and preparation techniques of WCu/MoCu alloys are reviewed.Moreover,prospects on the development trend of WCu/MoCu alloys are presented,aiming at the key property of high thermal conductivity.

关 键 词：WCu/MoCu合金 电子封装 热导率 热膨胀系数 发展趋势 

分 类 号：O647.9[理学—物理化学]