多芯片组件电路封装的频域分析和仿真  

Analysis and Simulation of MCM Packaging in Frequency Domain

作　　者：畅艺峰 邹旭军 董戴 李智荣 雷群龙 CHANG Yi-feng;ZOU Xu-jun;DONG Dai;LI Zhi-rong;LEI Qun-long(Key Laboratory of Special Communication Bearer Network,Shenzhen Avic Bit Communication Technology Co.,Ltd.,Shenzhen Guangdong 518000,China)

机构地区：[1]深圳市中航比特通讯技术有限公司专用通讯承载网络重点实验室,广东深圳518000

出　　处：《通信技术》2019年第2期482-484,共3页Communications Technology

基　　金：深圳市科技创新委员会技术攻关项目资助(No.JSGG20170414112835373)~~

摘　　要：改进数字显示电路的技术控制单元,采用多芯片组件技术,利用APD(Advanced PackageDesigner)软件,对数字显示电路进行MCM封装,以实现更高的封装密度和工作频率。多芯片组件(MCM)封装模拟仿真结果表明,MCM封装后电路的响应时间可以满足设计要求。Spectra计算结果表明,采用改进方法和MCM封装技术,可明显改善信号的延时和电磁干扰强度,分析与计算结果一致。By modifying the technology control unit of digital display circuit,adopting the multi-chip component technology and utilizing APD(Advanced Package Designer)software,the digital display circuit is encapsulated with MCM,thus to achieve higher encapsulation density and working frequency.Simulation results of MCM(multi-chip module)package indicate that the response time of MCM package could meet the design requirements.The Spectra calculation results show that with modified method and MCM encapsulation technology,the signal delay and electromagnetic interference intensity can be significantly improved.

关 键 词：多芯片组件 布局布线 频域 仿真 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]