提高MEMS用超薄硅片厚度测量质量的研究  

To Improve the Measurement Quality of Ultra-thin and High Precision Silicon Wafers by MEMS

作　　者：王世援[1] WANG Shiyuan(The 46th Research Institute of CETC,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《电子工业专用设备》2019年第1期41-44,共4页Equipment for Electronic Products Manufacturing

摘　　要：从常用MEMS器件用硅片对厚度测试要求的角度出发,分析了厚度测试设备-晶片厚度测试系统在测试MEMS用超薄高精度硅片时引发测量不确定度的主要来源,并对各来源引起的不确定度分量大小进行了计算。结果表明,测试用的校准厚度样片是影响整个测试系统不确定度的主要因素。重点研究了校准样片的几何参数(主要指局部厚度变化D_(LTV))与其本身不确定度的关系。研究发现,降低校准样片的D_(LTV)值能够有效降低其不确定度大小,当D_(LTV)值为0.46μm时,校准样片的扩展不确定度值为0.3μm,整个测试系统的扩展不确定度值为0.5μm,能够较好地提升测试质量、保证硅片初始厚度的一致性。For MEMS devices with high precision and small volume, the effect of thickness measurement is more prominent. Starting from the common MEMS devices with the wafer to the thickness of the perspective of test requirements, analysis of the test equipment - chip thickness test system in testing of MEMS thin high precision when the silicon wafer caused the main source of measurement uncertainty, and uncertainty caused by the source component size was calculated. The results show that the calibration thickness sample is the main factor affecting the uncertainty of the whole test system. In this paper, the relationship between the geometrical parameters (mainly DLTV) and its uncertainty is studied. The study found that reduce the DLTV value of the calibration plate can effectively reduce the uncertainty of size, when DLTV value equal to 0.46 microns, the expanded uncertainty of calibration samples value of 0.3 microns, the expanded uncertainty of the testing system value of 0.5 microns, can improve test quality, ensure consistency of initial thickness of silicon wafers.

关 键 词：校准样片 厚度 不确定度 局部厚度变化 

分 类 号：TN307[电子电信—物理电子学]