铝基板阳极氧化膜工艺及影响其绝缘性的因素  

Anodic oxidation process and influential factors to insulated function of anodic oxidation film

作　　者：黄凯龄 陈冠刚 麦东厂 郭文 Huang Kailing;Chen Guangang;Mai dongchang;Guowen

机构地区：[1]广东成德电子科技股份有限公司,广东佛山528300

出　　处：《印制电路信息》2019年第4期28-32,共5页Printed Circuit Information

摘　　要：介绍了铝基板制作工艺流程,并分析了电氧化中各种工艺参数对氧化膜绝缘性能的影响。This paper introduced technical flow which manufactures insulated aluminum based plate in details, and then it also analyzed various parameters affecting insulated function of anodic oxidation film during electrical oxidation procedure.

关 键 词：阳极氧化 铝基板 绝缘强度 

分 类 号：TN41[电子电信—微电子学与固体电子学]