一款化学镀铜用的活化浓缩液的配制及应用研究  

Preparation and utilization palladium colloid concentrate for electroless copper deposition

作　　者：杨志锋 Yang Zhifeng

机构地区：[1]西陇科学股份有限公司,广东广州510530

出　　处：《印制电路信息》2019年第4期40-42,共3页Printed Circuit Information

摘　　要：胶体钯是PCB业界孔金属化通用的活化剂,现开发出一款胶体钯浓缩液,钯胶体稳定,分散均匀,钯胶团大小适中。开缸使用活性高,使用稳定,钯吸附量少,背光效果优秀。Palladium colloid is a general activator for electroless metal deposition. A pd/sn colloid was developed in this paper, which is stable, evenly dispersed, and the size of palladium micelle is moderate. The activator has a high activity, high use stability, less palladium adsorption, and excellent backlight effect.

关 键 词：化学镀铜 活化 浓缩液 胶体钯 

分 类 号：TN41[电子电信—微电子学与固体电子学]