基于远程荧光粉与白光LED封装散热技术研究  

Research on Heat Dissipation Technology Based on Remote Phosphor and White LED Package

作　　者：曹小兵 黎兰兰 罗伟 CAO Xiaobing;LI Lanlan;LUO Wei(Xuyu Optoelectronics Co., Ltd., Shenzhen 518126, China)

机构地区：[1]旭宇光电(深圳)股份有限公司,广东深圳518126

出　　处：《中国照明电器》2019年第2期14-18,共5页China Light & Lighting

基　　金：深圳市科技攻关项目(重20180027)

摘　　要：远程荧光粉型白光LED封装散热设计有效改善封装技术存在色温漂移、出光不均匀和荧光粉性能衰减快等缺陷,可用于大功率LED及COB集成封装产品,是大功率白光LED散热封装设计技术的再次创新。重点研究如何将远程荧光技术与大功率LED集成封装技术结合制备,提升封装整体发光效率,使LED封装设计的自由度更大。The remote phosphor type white LED package heat dissipation design effectively improves the packaging technology, such as color temperature drift, uneven light emission and fast degradation of phosphor performance. It can be used in high-power LED and COB integrated package products. It is a new innovation in high-power white LED cooling package design technology. Our research centers on how to combine remote fluorescence technology with high-power LED integrated packaging technology to improve the overall luminous efficiency of the package, so that the freedom of LED package design is greater.

关 键 词：远程荧光粉 大功率 白光LED 封装 散热 

分 类 号：O482.7[理学—固体物理]