基于铜银微纳米复合层低温互连技术的研究  

Low-Temperature Bonding Method Based on Cu-Ag Macro-nano Multistage Coating

作　　者：肖金[1] 屈福康 程伟[1] XIAO Jin;QU Fu-kang;CHENG Wei(Huali College,Guangdong University of Technology,Guangzhou 511325,China)

机构地区：[1]广东工业大学华立学院,广东广州511325

出　　处：《机电工程技术》2019年第4期71-73,共3页Mechanical & Electrical Engineering Technology

基　　金：广东省2015年重点平台和重大科研项目(编号:2015KQNCX219)

摘　　要：提出了一种新颖的低温固态互连技术。通过特殊形貌的铜银微纳米复合层,在低温条件下,实现了良好的互连质量。通过扫描电子显微镜和焊接强度测试仪器分别分析了互连界面的显微组织形貌变化以及剪切强度变化趋势。结果表明,材料形貌结构产生的机械互锁以及固态原子扩散对互连强度具有积极影响。A novel low-temperature bonding technology was performed in this paper. In low-temperature, it is true to obtain good bonding quality through micro-nano multistage coating with special morphologies. Structure morphology of the interface of the bonding area were analyzed by X-ray diffractometer and the trend of the shear force strength was analyzed by welding strength tester. The results show that mechanical interlock and solid state atom diffusion have a positive effect on bonding strength.

关 键 词：低温互连 铜-银微纳米 互连强度 扩散 

分 类 号：TB383[一般工业技术—材料科学与工程]