基于单片机控制的智能超声波测厚系统的设计  

Design of Intelligent Ultrasound Thickness Measurement System Based on MCU Control

作　　者：张文远 宋苏阳 张捷 茹国宝[1] ZHANG Wenyuan;SONG Suyang;ZHANG Jie;RU Guobao(School of Electronic Information,Wuhan University,Hubei 430072,China;College of Optoelectronics,Huazhong University of Science and Technology,Hubei 430074,China;Liyuan Hospital of Tongji Medical College,Huazhong University of Science and Technology,Hubei 430077,China)

机构地区：[1]武汉大学电子信息学院,湖北430072 [2]华中科技大学光电学院,湖北430074 [3]华中科技大学同济医学院附属梨园医院,湖北430077

出　　处：《集成电路应用》2019年第5期103-104,共2页Application of IC

基　　金：湖北省教育系统科技创新课题项目

摘　　要：设计了一套基于单片机控制的智能超声波测厚系统的实验电路。分析超声波测厚的基本原理,对系统的设计方案进行了论证,进而给出了该实验的考核要求与方法。实验表明,通过该实验,可全面掌握单片机原理及其应用方面的专业知识,解决现代科研开发过程中的实际问题。This paper designs a set of experimental circuit of intelligent ultrasonic thickness measurement system based on single chip computer control.It analyses the basic principle of ultrasonic thickness measurement,demonstrates the design scheme of the system,and then gives the test requirements and methods of the experiment.Experiments show that through this experiment,we can fully grasp the principle of single chip computer and its application expertise,and solve the practical problems in the process of modern scientific research and development.

关 键 词：单片机控制 超声波 测厚 测速 

分 类 号：TB553[理学—物理]