基于Icepak的航天电子产品散热优化仿真分析  

Thermal Optimization Simulation of Aerospace Electronic Products Based on Icepak

作　　者：李正睿 杨欣悦 吴静 LI Zheng-rui;YANG Xin-yue;WU Jing(Hubei Sanjiang Aerospace RedPeak Control Co. ,Ltd. ,Xiaogan 432000,China)

机构地区：[1]湖北三江航天红峰控制有限公司,湖北孝感432000

出　　处：《电子机械工程》2019年第2期38-42,共5页Electro-Mechanical Engineering

摘　　要：随着航天电子产品朝着小型化和集成化方向发展,电子产品内部电子元器件的集成度和功率日益提高。传统的热设计主要基于实物试验采集机箱内部印制板核心元器件的温度,再根据实际情况进行印制板布局调整或结构件改进设计,该过程周期长且需要投入大量的实物试验成本和时间成本,严重制约了航天型号的研制周期。因此,文中以一种航天电子产品为例,通过运用Icepak软件对机箱内部元器件散热问题进行仿真,并通过优化改进,实现了对元器件温度降低达10℃以上,提升了产品可靠性。这种仿真手段相比传统模式大大缩短了航天产品的研发周期,降低了研发成本。With the development of aerospace electronic products toward miniaturization and integration,the integration and power of electronic components inside electronic products are increasingly improved. The traditional thermal design is mainly based on the experimental test to collect the temperature of the core components of the printed board inside the chassis,and then adjust the layout of the printed board or improve the structural parts according to the actual situation. This process takes a long period and requires a large amount of experimental and time cost,which seriously restricts the development cycle of space models. Therefore,this paper,taking an aerospace electronic product as an example,uses Icepak software to simulate the heat dissipation of the internal components of the chassis,and the temperature of the components is reduced by more than 10 ℃through certain optimization and improvement,which improves the reliability of the product. Compared with the traditional mode,this simulation method greatly shortens the research and development cycle of aerospace electronic products and reduces the research cost.

关 键 词：Icepak 散热优化 航天电子产品 

分 类 号：TK124[动力工程及工程热物理—工程热物理]