相变合金温控组件的制备及循环性能研究  

Research on Preparation and Cyclic Performance of Phase Change Alloy Thermal Control Module

作　　者：阎德劲[1] 苏欣 赖复尧[1] YAN Dejin;SU Xin;LAI Fuyao(The NO. 10 Research Institute,China Electronics Technology Group Corporation,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036

出　　处：《新技术新工艺》2019年第4期47-50,共4页New Technology & New Process

摘　　要：根据某弹载平台短时热耗高、工作时间短、热响应时间短的具体使用要求,选定了50Bi-27Pb-13Sn-10Cd作为相变材料,设计并制备了基于该种相变合金的温控组件,并通过理论计算和试验,比较了相同加热功率条件下相变合金温控组件和石蜡/泡沫铜相变温控组件温度-时间曲线的差异,以及经100次相变热循环前后的相变合金温控组件温控性能的变化情况。结果表明,与泡沫铜/石蜡相变温控组件相比,相变合金温控组件具有更好的控温效果,热响应时间<30s;经100次热循环后相变合金的相变温度变化率在3%以内,温控组件仍能保持良好的温控性能。According to the requirements of high heat consumption in short time,the short working time and the short thermal response time of specific missile-borne electronic equipment,50Bi-27Pb-13Sn-10Cd phase change alloy was chosen as phase change material.Based on it,a thermal control module was designed and manufactured.The temperature-time curve difference between phase change alloy thermal control module and paraffin/foamy copper phase change thermal control module under the same heating power condition of this thermal control device was compared through computing and testing.The heat dissipation performance of thermal control module filled with phase change alloy was compared before and after 100 times thermal cycle.The results showed that compared with paraffin/foamy copper phase change thermal control module,the thermal control module filled with phase change module had good thermal control effect,whose thermal response was less than 30 seconds,and it had better heat dissipation performance with which filled with paraffin,enhanced by copper foam.Meanwhile,the change rate of this thermal control device was within 3%,which mean the heat dissipation performance was still well after 100 times thermal cycle.

关 键 词：相变合金 温控组件 温控性能 热响应时间 热循环 相变温度 

分 类 号：TN605[电子电信—电路与系统]