脉冲镀铬镀层性能的研究  

Study on the Performance of Pulse Electroplating Chromium Plating

作　　者：李曼 邹松华 王帅东 王瑞超 王建波 LI Man;ZOU Songhua;WANG Shuaidong;WANG Ruichao;WANG Jianbo(Tianjin Long March Launch Vehicle Manufacturing Co. Ltd,Tianjin 300462,China)

机构地区：[1]天津航天长征火箭制造有限公司

出　　处：《电镀与精饰》2019年第6期43-46,共4页Plating & Finishing

摘　　要：为了提高铬镀层性能,简化工艺流程,提高电镀效率,本文对比了直流镀铬和脉冲镀铬工艺,研究了电镀工艺对镀层厚度均匀性、硬度、孔隙率、结合力、表面和截面微观形貌及镀层电镀效率的影响。结果表明,脉冲镀铬的镀层性能明显优于直流镀铬,其镀层硬度与直流镀层相比提高约8%。脉冲镀铬的电镀效率远高于直流电镀工艺,其可缩短电镀周期约53%。In this paper,the direct current(DC)electroplating chromium and pulse electroplating chromium technology were compared in order to improve the performance of chromium plating,simplify the process and improve the electroplating efficiency. The influence of the electroplating technology on the thickness,hardness,porosity,bonding force,surface and cross-section microstructure,and electrode-position efficiency of the plating were studied. The results showed that the performances of pulsed electroplating plating were better than that of DC electroplating obviously,the hardness of which was increasde by 8% than tnat of DC plating. In addition,the electrodeposition efficiency of pulse electroplating chromium was higher than that of DC electroplating also,the electroplating time could be reduced by 53% than the DC electroplating technology.

关 键 词：脉冲电镀 直流电镀 电镀时间 镀层厚度 镀层硬度 

分 类 号：TQ153.1[化学工程—电化学工业]