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作 者:刘萍 王永光[2] 赵永武 朱玉广 LIU Ping;WANG Yong-guang;ZHAO Yong-wu;ZHU Yu- guang(College of Mechanical Engineering, Jiangnan University, Wuxi 214122, China;School of Mechanical and Electric Engineering, Soochow University, Suzhou 215021, China)
机构地区:[1]江南大学机械工程学院,江苏无锡214122 [2]苏州大学机电工程学院,江苏苏州215021
出 处:《材料保护》2019年第5期6-11,共6页Materials Protection
基 金:国家自然科学基金项目(51775360,51005102,51675232);清华大学摩擦学国家重点实验室开放基金项目(SKLTKF10B04);教育部留学回国人员启动基金项目(20111139);中央高校基本科研业务费专项资金(JUSRP51729A);国家轻工技术与工程一流学科自主课题(2018-29)资助
摘 要:揭示铝低压力化学机械抛光(CMP)中的弱缓蚀机制是铝CMP研究的关键问题。采用CMP试验,研究了1,2,4-三唑(TAZ)和苯并三氮唑(BTA)对铝表面去除率的影响规律;通过接触角和表面原子力显微镜(AFM)试验,分析了TAZ和BTA薄膜在铝表面的亲水性能,发现由TAZ作用形成的缓蚀薄膜比由BTA形成的缓蚀薄膜更厚,更易渗透与去除。结合摩擦磨损试验和Arrhenius公式,探讨了TAZ和BTA在CMP过程中对铝表面化学反应活化能的影响。结果显示:TAZ的活化能小于BTA,更容易形成弱缓蚀薄膜,机械促进化学作用的效果更明显。To reveal the weak anti - corrosion mechanism on the aluminum surface was one of key points to study aluminum chemical mechanical polishing. The effects of 1,2,4- triazole (TAZ) and benzotriazole ( BTA) on the aluminum removal rate during chemical mechanical polishing (CMP) were studied by CMP experiments. The hydrophilicity of TAZ and BTA films on aluminum surface was analyzed by contact angle and atomic force microscopy ( AFM), and it was found that the inhibitor films formed from TAZ were thicker, and more permeable and easier to remove than the films formed from BTA. Moreover, the activation energy of aluminum surface with TAZ and BTA during CMP process was calculated by friction and wear test and Arrhenius formula, and the influences of TAZ and BTA on the chemical reaction activation energy of aluminum surface during CMP process were discussed. Results showed that in the comparison of BTA, TAZ had lower activation energy, and was more likely to form a weak corrosion inhibitor film, which could strength the facilitation effect of mechanical action on the chemical action significantly.
关 键 词:低压力 化学机械抛光 1 2 4-三唑 摩擦磨损 化学反应活化能
分 类 号:TG174.42[金属学及工艺—金属表面处理]
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