硅片清洗技术及发展  

Silicon Wafer Cleaning Technology and Its Development

作　　者：胡雅倩 HU Yaqian(The 46th Research Institute,CETC,Tianjin 300220,China)

机构地区：[1]中国电子科技集团有限公司第四十六研究所

出　　处：《天津科技》2019年第6期66-67,共2页Tianjin Science & Technology

摘　　要：在半导体硅片加工工序中,清洗是极其重要的一步,硅片的洁净与否,将直接决定后续产品性能。通过论述目前硅片化学清洗方法中常用的化学清洗溶液的清洗机理、清洗特点、清洗局限以及清洗对硅片表面微观状态的影响,针对硅片清洗工艺中存在的问题,提出了改进方向并展望了发展前景。In the process of semiconductor silicon wafer processing, cleaning is an important step. The cleanliness of silicon wafer will directly determine the performance of subsequent products. The cleaning mechanism, cleaning characteristics,cleaning limitations of chemical cleaning solutions commonly used in wafer chemical cleaning methods as well as the effect of cleaning on the surface microscopic state of silicon wafer are discussed. In view of the problems existing in the silicon wafer cleaning process, the improvement direction and the development prospects are put forward.

关 键 词：硅片 清洗 RCA 超声波 兆声波 

分 类 号：TN30[电子电信—物理电子学]